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Bell jar

product details

Name:

6-inch Quartz Bell Jar

Function & Application:

Primarily used as a reduction furnace cover for polysilicon. It is applied in photolithography processes during wafer manufacturing, which are low-temperature processes.

Performance Requirements:

Corrosion resistance, high optical transparency, and low impurity content.

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  • +86-572-3032373

    +86-572-3033016

More About Products

The High Quality Quartz Bell Jar is a precision-engineered cover primarily used in reduction furnaces for polysilicon during photolithography processes in semiconductor manufacturing. Designed for low-temperature applications, this bell jar provides excellent corrosion resistance and high optical transparency, allowing clear visual inspection and process monitoring.

Manufactured from ultra-pure fused quartz with low impurity content, the bell jar ensures minimal contamination and maintains cleanroom standards. Its durable construction withstands repeated use, making it an essential component for reliable wafer processing and enhanced manufacturing consistency. Ideal for advanced semiconductor fabs and research laboratories, the quartz bell jar supports precise process control and product quality.

Custom Quartz Bell Jar Solutions for Specialized Semiconductor Equipment

1. Tailored Dimensions and Designs

Custom quartz bell jars can be engineered to fit unique equipment geometries, accommodating different furnace sizes, wafer diameters, and process configurations while maintaining thermal stability and uniform coverage.

2. High Purity and Optical Transparency

Using high-quality fused quartz, custom bell jars provide excellent optical clarity and extremely low impurity levels. This minimizes contamination risks and ensures precise observation of wafers during low- or high-temperature processes.

3. Enhanced Thermal and Chemical Resistance

Custom quartz bell jars are designed to withstand the specific temperature ranges and chemical exposures of the process, ensuring durability and consistent performance in both low-temperature photolithography and high-temperature wafer processing.

4. Specialized Features for Process Optimization

Additional features like frosted surfaces, gas injection ports, or reinforced bases can be integrated to meet advanced process needs, improve gas flow, or reduce thermal shock risks.

Custom quartz bell jars deliver tailored solutions that maximize equipment efficiency, wafer protection, and process consistency. They are essential for semiconductor fabs, research centers, and specialized wafer fabrication setups that require precision and reliability.

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