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Quartz Boat

product details

Name:

6-inch Quartz Boat

Function & Application:

The quartz boat is a carrier used to transport and process semiconductor wafers. Wafers are placed onto the quartz boat and then loaded into the furnace tube for batch processing. It is applied in diffusion, oxidation, and CVD deposition processes in wafer manufacturing, which are high-temperature processes.

Performance Requirements:

High temperature resistance, corrosion resistance, excellent thermal stability, high optical transparency, and low impurity content.

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More About Products

High-Temperature Quartz Boats for Annealing are precision-engineered wafer carriers designed to withstand the demanding conditions of thermal annealing and other high-temperature semiconductor processes such as diffusion, oxidation, and CVD deposition. Made from high-purity fused quartz, these boats offer excellent thermal stability, low thermal expansion, and strong resistance to chemical corrosion and thermal shock.

Their robust structure ensures consistent wafer support and alignment during thermal cycling, while the smooth, low-particle surfaces help minimize contamination risks and protect wafer integrity. The boats are optimized for uniform heat transfer and gas flow within the furnace tube, enabling consistent annealing results across all wafers in a batch. Ideal for both production fabs and R&D environments, these quartz boats meet the stringent requirements of modern semiconductor manufacturing.

What is Annealing in Semiconductor Process?

Annealing in semiconductor processing is a crucial heat treatment step where silicon wafers are heated to high temperatures and then cooled under controlled conditions.

This process serves multiple purposes:

  • Activate Dopants: It activates implanted or diffused dopant atoms by allowing them to occupy substitutional positions in the silicon crystal lattice, enabling them to modify the electrical properties effectively.
  • Repair Crystal Damage: Annealing helps repair damage caused by ion implantation or other fabrication steps by healing defects and restoring crystal structure.
  • Improve Material Quality: It reduces stress and improves uniformity in thin films and layers, enhancing overall device performance.
  • Modify Electrical and Mechanical Properties: Annealing can adjust carrier mobility, reduce leakage currents, and stabilize interfaces between different materials.

Annealing is typically performed in specialized furnaces or rapid thermal processing (RTP) systems under controlled atmospheres (e.g., nitrogen or oxygen). It is a vital step to ensure the reliability and functionality of semiconductor devices.

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